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Wafer production line-Cutting Machine

Product Origin: China
Detailed Product Description:

Products Information

This machine can automatically cut the cooled wafers into pieces according to required sizes.

Technology and function
• Materials: Adopt imported stainless steel; German SEW motor.
• Different sizes of wafers can be cut by replacement of cutting knife.
• Automatical process, can cut 16 pieces per minute.
• Cutting method: Blade or steel wire type.
• External dimension(L×W×H): 2m×2m×0.87m
• Total power: 0.75KW
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